Thermal paste CPU Heat Sink Compound Paste(gold) ST700
01392
Description:
Thermal compound is necessary to create a reliable transfer of heat from your computer's
processor to its heatsink to keep your CPU from overheating. This thermal grease can be
used on the rear side of the heatsink which has no thermal pad. It will improve the heat disipation
of your processor. The thermal transfer compound improves the effectiveness of CPU coolers
by thermally bonding the CPU to the heatsink. This ensures that the heatsink and fan can
work at their full capacity to remove the harmful heat away from the CPU,
and prevent burnout or heat damage.
Specifications:
Color: Gold
Thermal Conductivity:>2.0W/m-k
Thermal Impedance : <0.136 Centigrade-in2/W
Specific Gravity: >2.1
Evaporation : <0.005%
Bleed : <0.05%
Dielectric Constant A : >5.0
Operation Temperature :-50~240 Centigrade
Silicone Compounds: 50%
Carbon Compounds : 10%
Metal Oxide Compounds: 40%
Thermal compound is necessary to create a reliable transfer of heat from your computer's
processor to its heatsink to keep your CPU from overheating. This thermal grease can be
used on the rear side of the heatsink which has no thermal pad. It will improve the heat disipation
of your processor. The thermal transfer compound improves the effectiveness of CPU coolers
by thermally bonding the CPU to the heatsink. This ensures that the heatsink and fan can
work at their full capacity to remove the harmful heat away from the CPU,
and prevent burnout or heat damage.
Specifications:
Color: Gold
Thermal Conductivity:>2.0W/m-k
Thermal Impedance : <0.136 Centigrade-in2/W
Specific Gravity: >2.1
Evaporation : <0.005%
Bleed : <0.05%
Dielectric Constant A : >5.0
Operation Temperature :-50~240 Centigrade
Silicone Compounds: 50%
Carbon Compounds : 10%
Metal Oxide Compounds: 40%
